symbol v ds v gs i dm i ar e ar t j , t stg symbol typ max 48 62.5 74 90 r q jl 32 40 a repetitive avalanche energy l=0.1mh c 12.8 mj avalanche current c 16 pulsed drain current c continuous drain current t a =25c t a =70c junction and storage temperature range -55 to 150 c thermal characteristics t 10s c/w parameter r q ja units maximum junction-to-ambient a v v 3 0 gate-source voltage drain-source voltage 80 maximum units parameter ab solute maximum ratings t a =2 5c unless otherwise noted a i d 3.5 2.9 18 power dissipation b p d w 2 t a =25c 1.3 t a =70c maximum junction-to-lead steady-state c/w steady-state c/w maximum junction-to-ambient a d g2 d 2 s2 g1 d 1 s1 product summary v ds (v) r ds(on) ( ? )i d (a) a q g (typ.) 80 0. 075 at v gs = 10 v 3.5 7.3 nc so-8 5 6 7 8 t op v ie w 2 3 4 1 features ? halogen-free acc o rding to iec 61249-2-21 definition ? trenchfet ? power mosfet ? 100 % r g and uis tested ? compl iant to rohs directive 2002/95/ec applications ? dc/dc conve rsion - notebook system power n-channel 80 v (d-s) mosfet s1 g 1 s2 g2 d1 d1 d2 d2 dt . www. daysemi.jp
sym bol min typ max units bv dss 80 v v ds =80 v, v gs =0v 1 t j =55 c 5 i gss 100 na v gs( th) gat e threshold voltage 3.5 4.2 5 v i d(o n) 18 a 62 75 t j =12 5c 113.0 135 g fs 15 s v sd 0.7 7 1 v i s 2.5 a i sm 18 a c iss 510 640 770 pf c oss 28 4 0 52 pf c rss 12 2 0 30 pf r g 0.9 1.8 2.7 w q g (10 v) 8 11 13 nc q g (4. 5v) 4 5.5 7 q gs 4 5 6 nc q gd 0.7 1.2 1.7 nc t d(o n) 7.2 n s t r 2.2 n s t d(o ff) 17 ns t f 2 ns t rr 14 2 0 26 ns q rr 35 5 0 65 nc body diode reverse recovery charge i f =3. 5a, di/dt=300a/ m s pulsed body-diode current c inp ut capacitance output capacitance turn-on delaytime dynamic parameters turn-on rise time turn-off delaytime v gs =10 v, v ds =40 v, r l =8 w , r gen =3 w gat e resistance v gs =0v , v ds =0v , f=1mhz turn-off fall time total gate charge v gs =10 v, v ds =40 v, i d =3. 5a gate source charge gate drain charge total gate charge switching parameters m w i s =1a ,v gs =0v v ds =5v , i d =3. 5a forward transconductance diode forward voltage r ds( on) sta tic drain-source on-resistance electrical characteristics (t j =25 c unless otherwise noted) static parameters parameter conditions i dss m a v ds =v gs i d =25 0 m a v ds =0v , v gs = 30v zero gate voltage drain current gate-body leakage current maximum body-diode continuous current body diode reverse recovery time drain-source breakdown voltage on state drain current i d =25 0 m a, v gs =0v v gs =10 v, v ds =5v v gs =10 v, i d =3. 5a reverse transfer capacitance i f =3. 5a, di/dt=300a/ m s v gs =0v , v ds =40 v, f=1mhz a. the value of r q ja is measured with the device mounted on 1in 2 fr-4 board with 2oz. copper, in a still air environment with t a =25c. the value in any given application depends on the user's specific board design. b. the power dissipation p d is based on t j(max) =150c, using 10s junction-to-ambient thermal resistance. c. repetitive rating, pulse width limited by junction temperature t j(max) =150c. ratings are based on low frequency and duty cycles to keep initialt j =25c. d. the r q ja is the sum of the thermal impedence from junction to lead r q jl and lead to ambient. e. the static characteristics in figures 1 to 6 are obtained using <300 m s pulses, duty cycle 0.5% max. f. these curves are based on the junction-to-ambient thermal impedence which is measured with the devi ce mounted on 1in 2 f r-4 board with dt . www. daysemi.jp
ty pical electrical and thermal characteristics 17 5 2 10 0 18 40 0 4 8 12 1 6 20 3 4 5 6 7 v gs (v olts) figure 2: transfer characteristics (note e) i d (a ) 50 6 0 70 80 90 100 0 4 8 12 16 20 i d ( a) figure 3: on-resistance vs. drain current and gate voltage (note e) r d s (on) ( m w w w w ) 1. 0e-05 1.0e-04 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.0e+01 1.0e+02 0.0 0.2 0.4 0.6 0.8 1.0 1.2 v sd ( volts) figure 6: body-diode characteristics (note e) i s ( a) 25 c 12 5c 0. 8 1 1.2 1.4 1.6 1.8 2 2.2 0 25 50 75 100 125 150 175 temperature (c) figure 4: on-resistance vs. junction temperature (note e) nor malized on-resistance v gs =1 0v i d =3 .5a 50 7 0 90 110 130 150 4 8 12 16 20 v gs ( volts) figure 5: on-resistance vs. gate-source voltage (note e) r d s (on) ( m w w w w ) 25 c 12 5c v ds =5 v v gs =1 0v i d =3 .5a 25 c 12 5c 0 4 8 12 1 6 20 0 1 2 3 4 5 v ds ( volts) fig 1: on-region characteristics (note e) i d ( a) 6v 7 v 10v 5. 5v 5v dt . www. daysemi.jp
ty pical electrical and thermal characteristics 0 2 4 6 8 10 0 2 4 6 8 10 12 q g ( nc) figure 7: gate-charge characteristics v g s ( volts) 0 20 0 400 600 800 1000 0 20 40 60 80 v ds ( volts) figure 8: capacitance characteristics ca pacitance (pf) c is s c os s c rs s v ds =4 0v i d =3 .5a 0. 0 0.1 1.0 10.0 100.0 0.1 1 10 100 v ds ( volts) i d ( amps) fi gure 9: maximum forward biased safe operating area (note f) 10 m s 10 s 1m s dc r ds (on) li mited t j( max) =1 50c t a =2 5c 10 0 m s 1 10 1 00 1000 0.00001 0.001 0.1 10 1000 pulse width (s) figure 10: single pulse power rating junction-to-ambient (note f) p ow er (w) t a =2 5c 10 ms 10 0ms 1 10 1 00 0.000001 0.00001 0.0001 time in avalanche, t a ( s) figure 12: single pulse avalanche capability i d ( a ), peak avalanche current 10 ms 10 0m t a =2 5c t a =1 50c t a =1 00c t a =1 25c dt . www. daysemi.jp
ty pical electrical and thermal characteristics 0. 01 0.1 1 10 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 pulse width (s) figure 11: normalized maximum transient thermal impedance (note f) z q q q q j a n ormalized transient thermal resistance si ngle pulse d= t on /t t j, pk =t a +p dm .z q ja .r q ja t on t p d in descending order d=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse r q ja =9 0c/w dt . www. daysemi.jp
www. daysemi.jp 1 dim millimeters inch es min max min max a 1.35 1.7 5 0.053 0.069 a 1 0.10 0.2 0 0.00 4 0.008 b 0.35 0.51 0.014 0.020 c 0.19 0.25 0.0075 0.010 d 4.80 5.00 0.189 0.196 e 3.80 4.00 0.150 0.157 e 1.27 bsc 0.050 bsc h 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.020 l 0.50 0.93 0.020 0.037 q0 8 0 8 s 0.44 0.64 0.018 0.026 ecn: c-06527-rev. i, 11-sep-06 dwg: 5498 4 3 1 2 5 6 8 7 h e h x 45 c all le a d s q 0.101 mm 0.004" l ba 1 a e d 0.25 mm (g a ge pl a ne) s oic (narrow): 8-lead jedec p a rt n u m b er: m s -012 s package information
www .daysemi.jp 1 application note recommen ded minimum pads for so-8 0.246 (6.248) recommended mi nimum pads dimensions in inches/(mm) 0.172 (4.369) 0.152 (3.861) 0.047 (1.194) 0.028 (0.71 1) 0.050 (1.270) 0.022 (0.559) return to index r e turn to index application note
legal disclaimer notice www. daysemi.jp 1 disclaimer all product, product specifications and data are subject to change without notice to improve reliability, function or design or otherwise. din-tek intertechnology, inc., its affiliates, agents, and employee s, and all persons acting on it s or their behalf (collectivel y, din-tek ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any o ther disclosure relating to any product. din-tek makes no warranty, repres entation or guarantee regarding the suitabilit y of the products for any particular purpose or the continuing production of any product. to the maximum extent permitted by applicable law, din-tek disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation specia l, consequential or incidental damages, and (iii) any and all i mplied warranties, including warra nties of fitness for particular purpose, non-infringement and merchantability. statements regarding the suitability of products for certain type s of applications are based on din-tek s knowledge of typical requirements that are often placed on din-tek products in generic applications. such statements are not binding statements about the suitability of products for a particular application. it is the customers responsib ility to validate that a particu lar product with the properties descri bed in the product specification is suitable fo r use in a particular application. parameters provided in datasheets and/or specification s may vary in different applications an d performance may vary over time. all operating parameters, including typical pa rameters, must be validated for each customer application by the customers technical experts. product specifications do not expand or otherwise modify din-tek s terms and condit ions of purchase, including but not limited to the warranty expressed therein. except as expressly indicate d in writing, din-tek products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the din-tek product could result in personal injury or death. customers using or selling din-tek products not expressly indicated for use in such applications do so at their own risk. pleas e contact authorized din-tek personnel to ob tain written terms and conditions regarding products designed for such applications. no license, express or implied, by estoppel or otherwise, to any intellectual prope rty rights is granted by this document or by any conduct of din-tek . product names and markings noted herein may be trad emarks of their respective owners. material category policy din-tek intertechnology, inc. hereby certi fies that all its products that are id entified as rohs-compliant fulfill the definitions and restrictions defined under directive 2011/65/eu of the euro pean parliament and of the council of june 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (eee) - recast, unless otherwis e specified as non-compliant. please note that some din-tek documentation may still make reference to rohs directive 2002/95/ ec. we confirm that all the products identified as being compliant to directive 2002 /95/ec conform to directive 2011/65/eu. din-tek intertechnology, inc. hereby certifi es that all its products that are identified as ha logen-free follow halogen-free requirements as per jedec js709a stan dards. please note that some din-tek documentation may still make reference to the iec 61249-2-21 definition. we co nfirm that all the products identified as being compliant to iec 61249-2-21 conform to jedec js709a standards. legal disclaimer notice www.daysemi.jp revision: 02-oct-12 1 document number: 72610 disclaimer all product, product specifications and data are subject to change without notice to improve reliability, function or design or otherwise. din-tek intertechnology, inc., its affiliates, agents, and employee s, and all persons acting on it s or their behalf (collectivel y, din-tek ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any o ther disclosure relating to any product. din-tek makes no warranty, repres entation or guarantee regarding the suitabilit y of the products for any particular purpose or the continuing production of any product. to the maximum extent permitted by applicable law, din-tek disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation specia l, consequential or incidental damages, and (iii) any and all i mplied warranties, including warra nties of fitness for particular purpose, non-infringement and merchantability. statements regarding the suitability of products for certain type s of applications are based on din-tek s knowledge of typical requirements that are often placed on din-tek products in generic applications. such statements are not binding statements about the suitability of products for a particular application. it is the customers responsib ility to validate that a particu lar product with the properties descri bed in the product specification is suitable fo r use in a particular application. parameters provided in datasheets and/or specification s may vary in different applications an d performance may vary over time. all operating parameters, including typical pa rameters, must be validated for each customer application by the customers technical experts. product specifications do not expand or otherwise modify din-tek s terms and condit ions of purchase, including but not limited to the warranty expressed therein. except as expressly indicate d in writing, din-tek products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the din-tek product could result in personal injury or death. customers using or selling din-tek products not expressly indicated for use in such applications do so at their own risk. pleas e contact authorized din-tek personnel to ob tain written terms and conditions regarding products designed for such applications. no license, express or implied, by estoppel or otherwise, to any intellectual prope rty rights is granted by this document or by any conduct of din-tek . product names and markings noted herein may be trad emarks of their respective owners. material category policy din-tek intertechnology, inc. hereby certi fies that all its products that are id entified as rohs-compliant fulfill the definitions and restrictions defined under directive 2011/65/eu of the euro pean parliament and of the council of june 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (eee) - recast, unless otherwis e specified as non-compliant. please note that some din-tek documentation may still make reference to rohs directive 2002/95/ ec. we confirm that all the products identified as being compliant to directive 2002 /95/ec conform to directive 2011/65/eu. din-tek intertechnology, inc. hereby certifi es that all its products that are identified as ha logen-free follow halogen-free requirements as per jedec js709a stan dards. please note that some din-tek documentation may still make reference to the iec 61249-2-21 definition. we co nfirm that all the products identified as being compliant to iec 61249-2-21 conform to jedec js709a standards.
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